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晶圆接受测试 (Wafer Acceptance Test) 是晶圆出厂前判定整片晶圆是否可靠的途径，在划片槽内检测晶圆各项参数，也称为晶圆参数测试（Wafer Acceptance Test）或者低漏电测试 （Low Leakage Test）
如何准确测试低至pA以下的极低漏电流具有挑战，MemsFlex 推出 ParaTect™ By Cantilever 系列，使用隔离性能极好的陶瓷PCB，选用漏电性能较好的针材和树脂，配合接地保护，常规的悬臂式探针卡结构设计能够准确测量 0.3pA以下的电流
结合2D MEM探针设计，Paratect™ By MEMS Seires 最低可做到10fA的漏电流测量
微针提供种探针组合的晶圆接受测试探针卡，使用铼钨针，P7针，MEMS等探针配合探针卡做DC Parameter/ Low Leakage低漏电测试，用优秀的漏电测试能力，优秀的接触电阻控制能力（30mA条件 < 2Ω）协助客户完成WAT测试
Pin Type 探针类型：
Paratect™ by MEMS
Paratect™ by Cantilever
Item | Paratect™ By MEMS | Paratect™ By Cantilever | |
Tester name | HP-4081 (HP-407x Compatible) | ||
Leakage current | < 10fA/V (@10V, 10sec) | < 0.3pA/V (@10V, 10sec) | |
Probe depth | 6mm (±0.25mm) | 8mm (±0.25mm) | |
No. of Probe | 25 pins (25×1) | 48 pins | |
Probe pitch | 72㎛ | 90㎛ | |
Pad Material | Mainly Cu, also extend to Al and/or Sal | ||
Overdrive | Recommend 2~3mil (MAX. 5mil) | ||
Scrub mark size | < 15㎛ (@ OD 4mil) | ||
Contact force | 1.3 g/mil | ||
Contact resistance | < 2.0 Ohms at 30mA | ||
Planarity | < ±5㎛ | ||
Alignment | < ±3㎛ in both X and Y | ||
Lifetime | 3 million TDs | 1 million TDs | |
Test Temp. | Ambient, but can be extended to —40 to 125℃ | ||
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