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晶圆接受测试 (Wafer Acceptance Test) 是晶圆出厂前判定整片晶圆是否可靠的途径,在划片槽内检测晶圆各项参数,也称为晶圆参数测试(Wafer Acceptance Test)或者低漏电测试 (Low Leakage Test)
如何准确测试低至pA以下的极低漏电流具有挑战,MemsFlex 推出 ParaTect™ By Cantilever 系列,使用隔离性能极好的陶瓷PCB,选用漏电性能较好的针材和树脂,配合接地保护,常规的悬臂式探针卡结构设计能够准确测量 0.3pA以下的电流
结合2D MEM探针设计,Paratect™ By MEMS Seires 最低可做到10fA的漏电流测量
微针提供种探针组合的晶圆接受测试探针卡,使用铼钨针,P7针,MEMS等探针配合探针卡做DC Parameter/ Low Leakage低漏电测试,用优秀的漏电测试能力,优秀的接触电阻控制能力(30mA条件 < 2Ω)协助客户完成WAT测试
Pin Type 探针类型:
Paratect™ by MEMS
Paratect™ by Cantilever
Item
Paratect™ By MEMS
Paratect™ By Cantilever
Tester name
HP-4081 (HP-407x Compatible)
Leakage current
< 10fA/V (@10V, 10sec)
< 0.3pA/V (@10V, 10sec)
Probe depth
6mm (±0.25mm)
8mm (±0.25mm)
No. of Probe
25 pins (25×1)
48 pins
Probe pitch
72㎛
90㎛
Pad Material
Mainly Cu, also extend to Al and/or Sal
Overdrive
Recommend 2~3mil (MAX. 5mil)
Scrub mark size
< 15㎛ (@ OD 4mil)
Contact force
1.3 g/mil
Contact resistance
< 2.0 Ohms at 30mA
Planarity
< ±5㎛
Alignment
< ±3㎛ in both X and Y
Lifetime
3 million TDs
1 million TDs
Test Temp.
Ambient, but can be extended to —40 to 125℃